•100WPH @ 8 inch wafers
•Metal addition Free design and Long Term Stable Process with SiC Tray
•Easy maintenance with Automatic Head Lifting mechanism and automated Tray Replacement System


•Revised to high speed tray transfer system to realise 100WPH.
•AMAX Type Dispersion Heads, Post Mix Dispersion Heads to mix SiH4, PH3, B2H6 and O2 at deposition zone to deposite LTO realize excellent film thickness and Dopant Uniformity.
•SiC Trays as susceptors prevent heavy metal addition and help long term stable process for long term production.
•Good maintenability and Operators safety are given by automated head base liftting system and automated tray exchange system, that shorten PM time for longer use of system