•120WPH at 6 inch and/or smaller dia. Wafers.
•Metal addition Free design and Long Term Stable Process with SiC Tray.


•High volume production continuous APCVD to meet with user’s need to process 120WPM for 6 inch and smaller wafers.
•Developped wider area deposition dispersion head dedicated to A6300S and minimize the number of trays to reduce the cost of system.
•SiC Trays as susceptors prevent heavy metal addition and help long term stable process for long term production.
•Good maintenability and Operators safety are given by automated head base liftting system and automated tray exchange system, that shorten PM time for longer use of system