D501

  • Batch Type APCVD, with a Large Tray to place variety size of Wafers.
  • Various Types of Film (SiO2, Al2O3, Etc)

Feature

  • Can place wafers on SiC tray manulally. Chips or different size of wafers can be placed on SiC Tray..
  • Small Footprint for R&D and Pilot Production.
  • Various Types of Film (SiO2, Al2O3, Etc) is available.